代理产品讯息

 日期        标 题

2018-11-22 [GIGABYTE]技嘉科技推出高频交易系统解决方案
2018-11-19 [Western Digital] Western Digital集团旗下品牌整合通知
2018-11-15 [Gigabyte] 技嘉科技推出两款经济型G481系列高速运算伺服器
2018-11-08 [AMD] AMD EPYC 处理器方案为亚马逊云端运算服务采用 Amazon EC2 Instance的三项全新部署象征AMD EPYC 在资料中心的重大里程碑
2018-11-02 EPC Partners with Wireless Power Innovators to Lead the Way in 5G Applications and Beyond
2018-11-01 [GIGABYTE]技嘉科技推出新款AMD EPYC系列主机板及2U机身4节点高密度伺服器,为客户带来更多新选择!
2018-10-31 [GIGABYTE] 云端 . AI . 智能 . 软体定义最佳推手 技嘉科技2018年成果发表会
2018-10-30 [XMOS] 技术驱动再亮剑,XMOS帮助创维创“芯”
2018-10-30 [AMD] AMD第2代Ryzen™ Threadripper™桌上型处理器扩大产品阵容
2018-10-29 [Western Digital] Western Digital持续在企业级硬碟领域领先
2018-10-18 [Gigabyte] 技嘉科技推出G291-2G0超高密度高效能运算伺服器支援16张NVIDIA TESLA P4运算卡进行深度学习推论部署
2018-10-09 Lattice sensAI™为终端AI应用提供更灵活的性能和功耗优化
2018-09-12 [EPC] 宜普电源转换公司(EPC)推出100 V氮化镓(eGaNR)功率电晶体 --尺寸比等效矽元件小30倍及工作在500 kHz频率时可实现97%效率
2018-09-05 [Infineon] 全球首款可携式录音工作室:英飞凌数位 MEMS 技术打造 Zylia ZM-1 麦克风阵列
2018-08-16 [Gigabyte] 技嘉科技发表搭载ThunderX2处理器伺服器产品
2018-08-09 [Microchip] Microchip业界首款汽车安全开发套件 保护汽车网路免受骇客攻击
2018-07-12 [Microchip] 利用全新8位元tinyAVRR MCU增加感测器节点功能
2018-07-10 [Infineon] 新型高性能谐振控制器IC,带有PFC,用于电源和照明驱动器
2018-06-19 [Molex] Molex Announces New Arkansas Design Center
2018-06-19 [HGST] HGST 硬碟机品牌将全面以 Western Digital 品牌取代
2018-06-06 [AMD] 突破CPU与GPU效能极限 AMD在2018台北国际电脑展展现新一代Ryzen、Radeon、EPYC领先优势
2018-06-05 [EPC] Simultaneously Power (or Charge) Cell Phones to Laptops Wirelessly with EPC’s Complete Class 4 Transmitter Paired with A Regulated Category 5 AirFuel™ Alliance Compatible Wireless Power Demonstration Kit Capable of Receiving up to 27 W at 19 V
2018-06-05 [Mellanox] Mellanox与技嘉联合展示人工智慧混和云平台
2018-06-04 [Vishay] Vishay's New High Current Planar Choke Inductor Delivers Same Performance as Wirewounds in Fraction of Space
2018-06-01 [EPC] jjPLUS and Efficient Power Conversion (EPC) Showcasing Wide Surface-Area, Multiple-Device Wireless Power Solutions at InnoVEX 2018
2018-05-29 [ Infineon] 650V IGBT采用表面贴装D2PAK封装实现最大功率密度
2018-05-21 [Lattice] 超低功耗Lattice SensAI引领网络边缘人工智慧设备迈向大众市场
2018-05-16 [Vishay] Vishay Intertechnology Snap-in Power Aluminum Capacitors Save Space, Lower Costs for Power Supplies, Solar Inverters, and Motor Controls
2018-05-15 [Lattice] 莱迪思拓展其模组化视频界面平台(VIP)以简化嵌入式视觉系统的视频互连设计
2018-04-30 [XMOS] XMOS 宣布在中国和台湾与威健签署新的地区分销协议
2018-04-27 [EPC] EPC Introduces 350 V eGaNR Power Transistor − 20 Times Smaller Than Comparable Silicon
2018-04-03 [Infineon] CoolSETTM家族:全新固定频率PWM控制器和集成功率IC带来高性能和电路保护
2018-03-30 [Vishay] Vishay Intertechnology Launches Its First Automotive Grade Phototransistor Optocoupler
2018-03-12 [ Infineon] 搭载英飞凌 XENSIV™ MEMS 麦克风:XMOS 推出适用于 Amazon AVS 的全新立体声 AEC 远场线性开发套件
2018-03-12 [Vishay] Vishay Intertechnology’s FRED PtR Ultrafast Rectifiers in FlatPAK™ 5x6 Package Increase Power Density, Performance Efficiency, and Device Reliability
2018-03-08 [EPC] Efficient Power Conversion (EPC) Experts Joining Engineers in China to Innovate New Designs by Maximizing GaN FET and IC Performance, More Than Just R
2018-01-12 [Vishay] Vishay Intertechnology to Highlight Automotive Product Line at Automotive World Japan Show 2018